Where academic tradition
meets the exciting future

You are here: TUCS > PUBLICATIONS > Publication Search > Thermal Influence on the Energ...

Thermal Influence on the Energy Efficiency of Workload Consolidation in Many-Core Architectures

Fredric Hällis, Simon Holmbacka, Wictor Lund, Robert Slotte, Sébastien Lafond, Johan Lilius, Thermal Influence on the Energy Efficiency of Workload Consolidation in Many-Core Architectures. In: Digital Communications - Green ICT (TIWDC), 2013 24th Tyrrhenian International Workshop on, 1–6, IEEE, 2013.

http://dx.doi.org/10.1109/TIWDC.2013.6664218

Abstract:

Webserver farms and datacenters currently use workload consolidation to match the dynamic workload with the available resources since switching off unused machines has been shown to save energy. The workload is placed on the active servers until the servers are saturated. The idea of workload consolidation can be brought also to chip level by the OS scheduler to pack as much workload to as few cores as possible in a many-core system. In this case all idle cores in the system are placed in a sleep state, and are woken up on-demand. Due to the relationship between static power dissipation and temperature, this paper investigates the thermal influence on the energy efficiency of chip level workload consolidation and its potential impact on the scheduling decisions. This work lay down the foundation for the development of a model for energy efficient OS scheduling for many-core processors taking into account external factors such as ambient and core level temperatures.

BibTeX entry:

@INPROCEEDINGS{aconv19813,
  title = {Thermal Influence on the Energy Efficiency of Workload Consolidation in Many-Core Architectures},
  booktitle = {Digital Communications - Green ICT (TIWDC), 2013 24th Tyrrhenian International Workshop on},
  author = {Hällis, Fredric and Holmbacka, Simon and Lund, Wictor and Slotte, Robert and Lafond, Sébastien and Lilius, Johan},
  publisher = {IEEE},
  pages = {1–6},
  year = {2013},
}

Belongs to TUCS Research Unit(s): Embedded Systems Laboratory (ESLAB)

Edit publication