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Thermal Analysis of Advanced 3D Stacked Systems

Kameswar Rao Vaddina, Amir-mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila, Thermal Analysis of Advanced 3D Stacked Systems. In: Narayanan Vijaykrishnan, V.Kamakoti (Eds.), 2011 IEEE Computer Society Annual Symposium on VLSI (ISVLSI’11), 371 - 372, IEEE Computer Society, 2011.

Abstract:

In this work, a 3D thermal model of a multicore system is developed to investigate the effects of hotspot, and placement of silicon die layers, on the thermal performance of a modern flip-chip package. In this regard, both the steady-state and transient heat transfer analysis has been performed on the 3D flip-chip package. Two different stacked die configurations were evaluated under different operating conditions. Through experimental simulations, we have found a configuration which has better thermal performance. The optimal placement solution is also provided based on the maximum temperature attained by the individual silicon dies. We have also provided the improvement that is required in the heat sink thermal resistance of a 3D system when compared to the single-die system.

BibTeX entry:

@INPROCEEDINGS{iRaRaLaLiPl11a,
  title = {Thermal Analysis of Advanced 3D Stacked Systems},
  booktitle = {2011 IEEE Computer Society Annual Symposium on VLSI (ISVLSI’11)},
  author = {Vaddina, Kameswar Rao and Rahmani, Amir-mohammad and Latif, Khalid and Liljeberg, Pasi and Plosila, Juha},
  editor = {Vijaykrishnan, Narayanan and V.Kamakoti},
  publisher = {IEEE Computer Society},
  pages = {371 - 372},
  year = {2011},
}

Belongs to TUCS Research Unit(s): Distributed Systems Laboratory (DS Lab)

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