• TUCS Publication Series
• How to Publish in TUCS Series
• Publication Search
• Publication Graph
• Publication Input
• Publication Input Guide
• JuFo Browser

Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's

Kameswar Rao Vaddina, Amir-mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila, Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's. In: Paris Kitsos (Ed.), IEEE/Euromicro International Conference on Digital System Design (DSD’11), 643-648, IEEE/EUROMICRO , 2011.

Abstract:

Three-dimensional technology offers greater device integration, reduced signal delay and reduced interconnect power. It also provides greater design flexibility by allowing heterogeneous integration. However, 3D technology exacerbates the on-chip thermal issues and increases packaging and cooling costs. In this work, a 3D thermal model of a stacked network-on-chip system is developed and thermal analysis is performed in order to analyze different job allocation and scheduling schemes using finite element simulations. The steady-state heat transfer analysis on the 3D stacked structure has been performed. We have analyzed the effect of variation of die power consumption, with and without hotspots, on peak temperatures in different layers of the stack. The optimal die placement solution is also provided based on the maximum temperature attained by the individual silicon dies.

BibTeX entry:

@INPROCEEDINGS{iVaRaLaLiPl11a,
  title = {Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's},
  booktitle = {IEEE/Euromicro International Conference on Digital System Design (DSD’11)},
  author = {Vaddina, Kameswar Rao and Rahmani, Amir-mohammad and Latif, Khalid and Liljeberg, Pasi and Plosila, Juha},
  editor = {Kitsos, Paris},
  publisher = {IEEE/EUROMICRO },
  pages = {643-648},
  year = {2011},
  keywords = {Thermal analysis, thermal modeling, 3D networks-on-chip, hotspots, thermal management, stacked IC’s},
}

Edit publication