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Thermal Modeling and Analysis of Advanced 3D Stacked Structures

Kameswar Rao Vaddina, Amir-mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila, Thermal Modeling and Analysis of Advanced 3D Stacked Structures. In: The International Conference on Communication Technology and System Design, ICCTSD 2011, -NA-, ELSEVIER, 2011.

Abstract:

The emerging three-dimensional integrated circuits (3D ICs) offer a promising solution to mitigate the barriers of interconnect scaling in modern systems. It also provides greater design flexibility by allowing heterogeneous integration. However, 3D technology exacerbates the on-chip thermal issues and increases packaging and cooling costs. In this work, a 3D thermal model of a stacked system is developed and thermal analysis is performed in order to analyze different workload conditions using finite element simulations. The steady-state heat transfer analysis on the 3D stacked structure has been performed in order to analyze the effect of variation of die power consumption, with and without hotspots, on temperature in different layers of the stack has been analyzed. We have also investigated the effect of the interaction of hotspots has on peak temperature.

BibTeX entry:

@INPROCEEDINGS{iVaRaLaLiPl11b,
  title = {Thermal Modeling and Analysis of Advanced 3D Stacked Structures},
  booktitle = {The International Conference on Communication Technology and System Design, ICCTSD 2011},
  author = {Vaddina, Kameswar Rao and Rahmani, Amir-mohammad and Latif, Khalid and Liljeberg, Pasi and Plosila, Juha},
  publisher = {ELSEVIER},
  pages = {-NA-},
  year = {2011},
  keywords = {Thermal   analysis,   thermal   modeling,   3D networks-on-chip, hotspots, thermal management, stacked IC’s},
}

Belongs to TUCS Research Unit(s): Distributed Systems Laboratory (DS Lab)

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