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Evaluation of Reflow Ovens for Lead-Free Soldering
Juha Lempinen, Aulis Tuominen, Evaluation of Reflow Ovens for Lead-Free Soldering. In: 25th International Conference on Microelectronics, 2006.
BibTeX entry:
@INPROCEEDINGS{inpLeTu06a,
title = {Evaluation of Reflow Ovens for Lead-Free Soldering},
booktitle = {25th International Conference on Microelectronics},
author = {Lempinen, Juha and Tuominen, Aulis},
year = {2006},
}
Belongs to TUCS Research Unit(s): TUCS Productization Laboratory