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Effect of Process Time on Reliability of Solder Joints in Reflow Soldering

Juha Lempinen, Aulis Tuominen, Ossi Hämeenoja, Timo Kerminen, Ilkka Tuokko, Effect of Process Time on Reliability of Solder Joints in Reflow Soldering. In: 4th European Microelectronics and Packaging Symposium with Table-Top Exhibition, Terme Catez, Slovenia, May, 22-24, 2006, 2006.

BibTeX entry:

@INPROCEEDINGS{inpLeTuHaKeTu06a,
  title = {Effect of Process Time on Reliability of Solder Joints in Reflow Soldering},
  booktitle = {4th European Microelectronics and Packaging Symposium with Table-Top Exhibition, Terme Catez, Slovenia, May, 22-24, 2006},
  author = {Lempinen, Juha and Tuominen, Aulis and Hämeenoja, Ossi and Kerminen, Timo and Tuokko, Ilkka},
  year = {2006},
}

Belongs to TUCS Research Unit(s): TUCS Productization Laboratory

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