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Thermal Shock Cycling of Sn/Ag/Cu, Sn/Cu/Ni, Sn/Pb/Ag and Sn/Pb Solder Joints

Juha Lempinen, Aulis Tuominen, Ossi Hämeenoja, Timo Kerminen, Ilkka Tuokko, Thermal Shock Cycling of Sn/Ag/Cu, Sn/Cu/Ni, Sn/Pb/Ag and Sn/Pb Solder Joints. In: IPC/Soldertec Global 4th International Conference and Exhibition , 2006.

BibTeX entry:

@INPROCEEDINGS{inpLeTuHaKeTu06b,
  title = {Thermal Shock Cycling of Sn/Ag/Cu, Sn/Cu/Ni, Sn/Pb/Ag and Sn/Pb Solder Joints},
  booktitle = {IPC/Soldertec Global 4th International Conference and Exhibition },
  author = {Lempinen, Juha and Tuominen, Aulis and Hämeenoja, Ossi and Kerminen, Timo and Tuokko, Ilkka},
  year = {2006},
}

Belongs to TUCS Research Unit(s): TUCS Productization Laboratory

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