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Reliability of Sn/Pb, Sn/Pb/Ag, Sn/Ag/Cu and Sn/Cu/Ni Solder Joints in Cyclic Mechanical Loading

Juha Lempinen, Aulis Tuominen, Timo Kerminen, Ilkka Tuokko, Reliability of Sn/Pb, Sn/Pb/Ag, Sn/Ag/Cu and Sn/Cu/Ni Solder Joints in Cyclic Mechanical Loading. In: International Conference on Electronics Packaging (ICEP2006), 2006.

BibTeX entry:

@INPROCEEDINGS{inpLeTuKeTu06a,
  title = {Reliability of Sn/Pb, Sn/Pb/Ag, Sn/Ag/Cu and Sn/Cu/Ni Solder Joints in Cyclic Mechanical Loading},
  booktitle = {International Conference on Electronics Packaging (ICEP2006)},
  author = {Lempinen, Juha and Tuominen, Aulis and Kerminen, Timo and Tuokko, Ilkka},
  year = {2006},
}

Belongs to TUCS Research Unit(s): TUCS Productization Laboratory

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