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Impacts of Printed Board SMD Layout Pattern Design on Flow Soldering Process Yield - Design Guidelines for Lead free Soldering

Yngvar Wikström, T. Kujala, Aulis Tuominen, Impacts of Printed Board SMD Layout Pattern Design on Flow Soldering Process Yield - Design Guidelines for Lead free Soldering. In: Ran Liu, Zhijun Qiu, Aulis Tuominen, Sami Hyrynsalmi (Eds.), Proceedings of NEXT 2009 - The Sixth International New Exploratory Technologies Conference, 28--36, 2009.

Abstract:

The overall aim was to solve the problem with low yield in a Wave soldering process. This part is a triangulation based research with focus on the design quality of the printed board artwork. The research is based on perception of test boards and soldered products, statistical methods, publications, theoretic approach and survey. Qualitative research is proofed by experiments in laboratory conditions. As the behavior of lead less soldering is different compared to leaded, new educational materials was needed. This research fulfills the demand trough this publication which is written to be used by any printed board artwork designer.

BibTeX entry:

@INPROCEEDINGS{inpWiKuTu09a,
  title = {Impacts of Printed Board SMD Layout Pattern Design on Flow Soldering Process Yield - Design Guidelines for Lead free Soldering},
  booktitle = {Proceedings of NEXT 2009 - The Sixth International New Exploratory Technologies Conference},
  author = {Wikström, Yngvar and Kujala, T. and Tuominen, Aulis},
  editor = {Liu, Ran and Qiu, Zhijun and Tuominen, Aulis and Hyrynsalmi, Sami},
  pages = {28--36},
  year = {2009},
}

Belongs to TUCS Research Unit(s): TUCS Productization Laboratory

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