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Power Distribution TSVs Induced Core Switching Noise

Waqar Ahmad, Rajeev Kumar Kanth, Qiang Chen, Lirong Zheng, Hannu Tenhunen, Power Distribution TSVs Induced Core Switching Noise . In: Conference Proceedings of Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE , 1, 1-4, Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE , 2010.

Abstract:

Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance
and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analyzed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analyzed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.

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BibTeX entry:

@INPROCEEDINGS{inpAhKaChZhTe10a,
  title = {Power Distribution TSVs Induced Core Switching Noise },
  booktitle = {Conference Proceedings of Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE },
  author = {Ahmad, Waqar and Kanth, Rajeev Kumar and Chen, Qiang and Zheng, Lirong and Tenhunen, Hannu},
  volume = {1},
  number = {978-1-4244-9069-1 },
  publisher = {Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE },
  pages = {1-4},
  year = {2010},
  keywords = { Core switching noise, Rise time, 3D stack, Skin effect},
}

Belongs to TUCS Research Unit(s): Communication Systems (ComSys)

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